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Capital Equipment

Capital equipment is a generic term to describe the machinery and equipment used within the electronics manufacturing process. Capital equipment is now manufactured throughout the world and covers every facet of electronic production from component manufacture through to component placement, assembly and test equipment.

We have listed a number of representatives' types of equipment below. Should you wish to add further categories, please contact our team at editors@electroviews.com with the category and a brief description.

  • Axial Insertion
  • Chip Bonding
  • Cleaning Equipment
  • Conformal Coating
  • Clean Room
  • Dip Insertion
  • Environmental Chambers
  • Extraction
  • Functional Test
  • Hand Tooling
  • HASL
  • Incircuit Test
  • JTAG/Boundary Scan
  • Odd Shaped Onsertion
  • PCB Drilling Machines
  • Process Control
  • Oven Profiling
  • Solder Paste Height Checks
  • Radial Insertion
  • Reflow Ovens
  • Rework & Repair
  • Screen Print
  • Selective Solder
  • Semiconductor Packaging
  • Solder Equipment
  • SMT Component Placement
  • Thermal Chambers
  • Wafer Fabrication
  • Waste Disposal
  • Wave Solder
  • Wire Bonding
  • X-Ray

Capital Equipment Topics

Axial Insertion

Radial Insertion

Capital Equipment Companies

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Guide Written by Paul Wilson

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Capital Equipment Articles

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